1. Introduction This system is to brush and rinse the SUS plate for laminating the copper clad laminates or printed circuit boards. The cleanliness, flatness and assembly steadiness of the SUS plate are essential to the high or low yield rate of finished boards. LIHSING has probed deeply to study the relevant material properties and physical characteristics of SUS plate, constantly innovated and devoted to the development in this regard and promoted the most adaptive solutions to achieve the foregoing objectives; that is, we want your SUS plate "Not only clean, but also clean thoroughly" 2. Principle Brushing play an important role amongst the production processes of CCL (Copper Clad Laminates) and PCB (Printed Circuit Boards). Its working principle is to take the advantage of non-woven fabric to polish the SUS plate through their contact with each other with pure water accommodated for lubrication and rinsing as an effort to achieve the purpose of cleaning the SUS plate. It is mainly applied to the following processes: de-smearing, surface treatment before solder masking and film drying, rinsing after spray soldering, etc. 3. Process <Loading>→wetting →brushing →rinsing →air drying→<unloading><Drying process is not necessary, so energy consumption is saved largely>